超细晶粒对纳晶材料断裂韧性的影响

EFFECTS OF ULTRAFINE GRAINS ON FRACTURE TOUGHNESS OF NANOCRYSTALLINE MATERIALS

  • 摘要: 为了研究纳米晶体材料的断裂韧性,该文建立了一个包含两种晶粒的材料模型:超细晶粒(2nm~4nm)和普通纳晶晶粒(20nm~100nm)。超细晶粒可以看作普通纳晶晶粒三晶交的组成部分,并称包含超细晶粒的三晶交为超级三晶交,且均匀地分布在普通纳晶的基体中。裂纹尖端的应力集中会引起晶间滑移,晶间滑移又会导致超级三晶交处刃型位错的产生。该文研究了超级三晶交处的位错对临界应力强度因子的影响,结果表明超细晶粒的存在有效地提高了纳米晶体材料的断裂韧性。

     

    Abstract: In order to study the fracture toughness of nanocrystalline, a material model was proposed. The model contains two types of grains: the ultrafine grains (ranging from 2 nm to 4 nm) and the normal nanograins (ranging from 20 nm to 100 nm). The ultrafine grains could be treated as a part of triple junctions, denoted as super triple junctions, and evenly distributed in the conventional nanocrystalline matrix. In the framework of our model, stress concentration near crack tip initiates intergrain sliding that leads to the generation of edge dislocations at super triple junctions. The effect of dislocation at a super triple junction on the critical intensity factors was studied. The results show that the existence of the ultrafine grains effectively enhances the fracture toughness of nanocrystalline.

     

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