Abstract: To address the issue of residual stress generated during the sintering and soldering processes of multilayer ceramic capacitors (MLCCs), this paper, based on composite material theory, simplifies the ceramic body of MLCCs using a homogenization method. A finite element model for the sintering and soldering process of MLCCs was constructed to analyze the impact of MLCC size parameters, of preheating temperature, and of solder type on residual stress during these processes. It was found that increasing the length of the termination or reducing the effective volume of the capacitor can effectively alleviate residual stress. Further observations revealed that as the preheating temperature increases, the residual stress at the junction of ceramic body and termination decreases. Considering the simulation results of two types of solders, the lead-free solder is more in line with the soldering quality requirements of the civil field. The above research on the termination and soldering processes can provide a theoretical support for the process optimization and design of MLCC products.